Systems and methods for sealing in site-isolated reactors

ABSTRACT

Substrate processing systems and methods are described for site-isolated processing of substrates. The processing systems include numerous site-isolated reactors (SIRs). The processing systems include a reactor block having a cell array that includes numerous SIRs. A sleeve is coupled to an interior of each of the SIRs. The sleeve includes a compliance device configured to dynamically control a vertical position of the sleeve in the SIR. A sealing system is configured to provide a seal between a region of a substrate and the interior of each of the SIRs. The processing system can include numerous modules that comprise one or more site-isolated reactors (SIRs) configured for one or more of molecular self-assembly and combinatorial processing of substrates.

RELATED APPLICATIONS

This application claims the benefit of U.S. patent application Ser. No.60/776,370, filed Feb. 24, 2006.

This application relates to U.S. patent application Ser. No. 11/132,841,filed May 18, 2005, Ser. No. 11/132,817, filed May 18, 2005, Ser. No.11/231,047, filed Sep. 19, 2005, Ser. No. 11/284,527, filed Nov. 22,2005, Ser. No. 60/725,186, filed Oct. 11, 2005, Ser. No. 11/352,077,filed Feb. 10, 2006, Ser. No. 11/352,016, filed Feb. 10, 2006, Ser. No.11/352,083, filed Feb. 10, 2006, and Ser. No. 11/351,978, filed Feb. 10,2006.

TECHNICAL FIELD

The disclosed embodiments relate to substrate processing and, moreparticularly, to substrate processing using site-isolated reactors.

BACKGROUND

In order to execute site-isolated (parallel, serial, and combinationsthereof) processing of regions of a substrate (such as but not limitedto blanket wafers, patterned wafers, substrates including devices,functional chips, functional devices, and test structures, etc.) withoutcross-contamination between reactors and/or regions, each reactor and/orregion must be effectively isolated from neighboring reactors and/orregions. Typical sealing mechanisms for full scale reactors (e.g. faceseals using o-rings) are not well-suited to this task. This is becausethese seals require a large compressive force and depend solely on thecompliance of the o-ring to provide the liquid or gas seal. Also, theseseals typically do not use the processed substrate (e.g. silicon) as asealing surface. As a result, the manufacturing tolerance and thecontamination properties are of secondary concern. Therefore there is aneed for sealing systems and methods that effectively seal isolatedsites during site-isolated substrate processing.

INCORPORATION BY REFERENCE

Each publication, patent, and/or patent application mentioned in thisspecification is herein incorporated by reference in its entirety to thesame extent as if each individual publication, patent and/or patentapplication was specifically and individually indicated to beincorporated by reference.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flow diagram for combinatorial process sequence integration,under an embodiment.

FIGS. 2A, 2B, and 2C show embodiments for site-isolated processing ofregions of a substrate, such as combinatorial process sequenceintegration, under an embodiment.

FIG. 3 shows a contact sealing system, under an embodiment.

FIG. 3A shows a contact sealing system in a multiprocessing cell arraymated to a stage which can hold a substrate, under an embodiment.

FIG. 3B and FIG. 3C show multiple views of a floating sleeve configuredto interface with an external mechanism for compliance within thereactor and to include a seal system in a lower region, under anembodiment.

FIG. 3D and FIG. 3E show multiple views of a floating sleeve configuredto include a flexure compliance mechanism for compliance within thereactor and a seal system in a lower region, under an embodiment.

FIG. 4 shows a hydrodynamic sealing system, under an embodiment.

In the drawings, the same reference numbers identify identical orsubstantially similar elements or acts. To easily identify thediscussion of any particular element or act, the most significant digitor digits in a reference number refer to the Figure number in which thatelement is first introduced (e.g., element 124 is first introduced anddiscussed with respect to FIG. 1).

DETAILED DESCRIPTION

Systems and methods for sealing site-isolated reactors are describedbelow that enable the miniaturization and parallelization of liquid andgas phase reactors for use in the development of processes for themanufacture of integrated circuits and other substrate-based components.Specifically the systems and methods described below provide sealingsystems for use in isolating reactions in reactors that are in closeproximity to other reactors. The reactors isolated according to thesealing systems and methods described herein include single reactors aswell as one or more sets or groups of reactors used in one or more ofserial, parallel; and/or serial parallel modes.

The embodiments described below for sealing reactors are for thediscovery, implementation, optimization, and qualification ofmaterial(s), process(es), and process integration sequence(s) requiredfor integrated circuit (IC) manufacturing, including but not limited tomethods for the combinatorial processing of and process sequenceintegration performed within regions on a single substrate usedtypically in device fabrication. The embodiments are described hereinwith regard to processing of integrated circuits (ICs), but can readilybe applied in the processing of other types of devices and theinvestigation of new materials for such uses. Some types of substrateswhich can be processed in accordance with the embodiments describedherein include, for example, blanket wafers, patterned wafers, andsubstrates including devices, functional chips, functional devices, andtest structures. More particularly, substrates which can be processed inaccordance with the embodiments herein include, but are not limited to,semiconductor devices, flat panel displays, optoelectronic devices, datastorage devices, magnetoelectronic devices, magnetooptic devices,molecular electronic devices, solar cells, photonic devices, andpackaged devices, or other devices.

The site-isolated reactors described below are used for example inprocessing substrates having an array of differentially processedregions wherein each region of a substrate is processed by deliveringmaterials to or modifying regions of the substrate. Processing includesbut is not limited to physical modifications, chemical modifications,electrical modifications, thermal modifications, magnetic modifications,photonic modifications, and photolytic modifications, more specificallycleaning, surface modification, surface preparation, deposition,dispensing, reaction, functionalization, etching, planarization,chemical mechanical planarization, electrochemical mechanicalplanarization, lithography, patterning, implantation, irradiation,electromagnetic irradiation, microwave irradiation, radio frequency (RF)irradiation, thermal treatment, infrared (IR) treatment, ultraviolet(UV) treatment, deep ultraviolet (DUV) treatment, extreme ultraviolet(EUV) treatment, electron beam treatment, and x-ray treatment, and morespecifically electrochemical deposition, electroless deposition,physical vapor deposition, chemical vapor deposition, atomic layerdeposition, vapor phase epitaxy, liquid phase epitaxy, chemical beamepitaxy, molecular beam epitaxy, molecular self-assembly, andevaporation. As such, the embodiments described below provide methodsand systems for the combinatorial processing and analysis of regions ofa substrate.

In the following description, numerous specific details are introducedto provide a thorough understanding of, and enabling description for,embodiments of the reactor sealing mechanisms. One skilled in therelevant art, however, will recognize that the embodiments herein can bepracticed without one or more of the specific details, or with othercomponents, systems, etc. In other instances, well-known structures oroperations are not shown, or are not described in detail, to avoidobscuring aspects of the embodiments.

Substrate processing generally includes processing an array of regionsby delivering processing materials to predefined regions on a substrateand/or modifying the predefined regions. FIG. 1 is a flow diagram forcombinatorial process sequence integration, under an embodiment. Theprocessing of an embodiment uses a processing tool (which may or may notbe an integrated tool comprised of discrete unit modules whichcollectively perform the effective unit process) that will perform thepre-specified process. In one embodiment, the processing tool canperform the process in a discretized fashion within unique regionscontained in a single monolithic substrate, such as a wafer used in ICmanufacturing. The substrate is provided to the system 100, and isprocessed in a discretized, isolated, fashion (either in a serial,parallel, or serial-parallel mode) in which at least two regions of thesubstrate are processed differently from each other 110. The substrateprocessed in this combinatorial fashion can optionally be previously 120and/or subsequently 130 processed in a conventional fashion with atleast one other process, wherein the entire or substantially close tothe entire substrate sees the same processing conditions. This allowsthe described combinatorial processing/combinatorial process sequenceintegration approach to be used in desired segments of the process flowrequired to build an end device(s) (e.g. integrated circuit, etc).

The processed regions of the substrate, such as devices or portions ofdevices created, can then be tested 140 for a property of interest usingconventional methods for analysis, such as parametric testing forproperties and/or reliability testing for example. The processed regionscan be tested simultaneously, sequentially, or in a parallel-serialmode, where a first plurality of regions is simultaneously tested,followed by a second plurality of regions being simultaneously tested.The testing 140 is optionally performed in one or more alternativeembodiments of the methodology for combinatorial process sequenceintegration.

The combinatorial process sequence integration of an embodiment uses aprocessing tool referred to herein as a site-isolated processing toolthat performs one or more processes. In one embodiment, thesite-isolated processing tool processes a substrate in a discretized,isolated fashion (either in a serial, parallel, or serial-parallel mode)within unique regions of the substrate (e.g., at least two regions ofthe substrate are processed differently from each other). In processingan array of regions, as described herein, processing materials can bedelivered to regions (including predefined regions) on a substrateand/or the regions (including predefined regions) can be modified usingany number of site-isolated processing processes or sequences incombination with any number of conventional processing processes orsequences.

For example, a method under the combinatorial process sequenceintegration of an embodiment receives a substrate from at least onefirst process selected from a group consisting of depositing,patterning, etching, cleaning, planarizing, implanting, and treating.The method generates a processed substrate by processing at least oneregion of the substrate differently from at least one other region ofthe substrate. The processing includes modifying the at least oneregion, wherein modifying includes at least one of physicalmodifications, chemical modifications, electrical modifications, thermalmodifications, magnetic modifications, photonic modifications, andphotolytic modifications, wherein the processing forms at least onearray of differentially processed regions on the substrate. In oneembodiment, the processing includes modifying using at least one ofmaterials, processing conditions, process sequences, process sequenceintegration, and process sequence conditions. In one other embodiment,the processed substrate is provided to at least one additional processselected from a group consisting of depositing, patterning, etching,cleaning, planarizing, implanting, and treating.

As another example, a method under the combinatorial process sequenceintegration herein generates a processed substrate by processing atleast one region of the substrate differently from at least one otherregion of the substrate. The processing includes modifying the at leastone region, wherein modifying includes at least one of physicalmodifications, chemical modifications, electrical modifications, thermalmodifications, magnetic modifications, photonic modifications, andphotolytic modifications, wherein the processing forms at least onearray of differentially processed regions on the substrate. The methodcontinues by providing the processed substrate to at least oneadditional process selected from a group consisting of depositing,patterning, etching, cleaning, planarizing, implanting, and treating. Inone embodiment, the processing includes modifying using at least one ofmaterials, processing conditions, process sequences, process sequenceintegration, and process sequence conditions.

As one example of site-isolated processing, FIGS. 2A, 2B, and 2C showembodiments for site-isolated processing of regions of a substrate, suchas combinatorial process sequence integration of wet processes used inIC and related manufacturing. FIG. 2A shows a bottom view of collectionof processing cells in a unitary structure 200, for example, in whichthe processing cells correspond to the individual die locations orportions of individual die locations within a single monolithicsubstrate, such as a wafer. The cross-section shape of the processingcells is not limited to a particular shape. For example, the processingcells of structure 200 have an approximately square design. In otherembodiments the processing cells of the structure 200 can have acircular cross-section (described in FIGS. 3 and 4 below).

In some embodiments, the structure 200 is designed to receive a sealingelement for creating a seal between the structure 200 and the substrateduring processing. In one embodiment, the structure 200 includes agroove 201 for receiving a single seal 206 that is adapted to provide asealing element around each processing cell of the structure 200. Inanother embodiment, the structure can utilize several seals for groupsor individual cells of the structure as described below.

As discussed above for the embodiments utilizing single processingcells, the structure 200 can also include inserts for each processingcell. The inserts can be designed to be disposable and optionally can beadapted to be used for specific types of processing. In this manner,different processes can be conducted on different regions by usingdifferent inserts in different cells of the structure.

Each processing cell of the structure 200 can be used to process aunique region on the substrate 202 in a unique fashion. Each unique siteisolated processing cell can also be used to perform a unique sequenceof unit processes. FIG. 2B shows a multiprocessing cell array 200 matedto a stage 204 which can hold the monolithic substrate 202. Positioningand alignment techniques can be used to align and position the cellarray 200 such that the cell array 200 is aligned to each correspondingdie on the substrate 202. This can be achieved using alignment pins inconjunction with stepper motors, or optical alignment, and/or otherknown techniques to move the substrate with respect to themulti-processing cell array.

A sealing element 206 such as individual elastomeric seals, e.g.o-rings, corresponding to each unique cell, or a preformed monolithicelastomeric seal can be used to form a seal when the processing cellarray 200 is brought into contact with the substrate 202. Theelastomeric seal 206 is chosen to be chemically inert and/or stable withrespect to the process and/or processing environment. For example, theelastomeric seal of an embodiment can be constructed of a material suchas Kalrez, Viton or Chemrez. Other sealing materials compatible with theprocess and/or processing environment of interest can be used asappropriate. The sealing element 206 is made to fit into themultiprocessing array 200 (such as in the groove 201) and is designedsuch that when in contact with the substrate 202, each discrete regionof the substrate 202 will be isolated from other regions or portions ofthe substrate 202. In this particular example, the stage is motorized soas to be able to move the substrate 202 vertically until such sealingcan be achieved. Dispensing, placing, processing, etc. within each cellcan be achieved using a serial dispenser 208 shown in FIG. 2C or in aparallel fashion with multiple dispensers (not shown).

An example of a structure for use in site-isolated processing of uniqueregions on a substrate includes the use of seals between reactors of thecell array and one or more regions of a target substrate. The sealingsystems and methods of an embodiment include two classes of seals. Afirst class of seal includes one or more contact seals while a secondclass of seal includes use of a hydrodynamic barrier formed using asealing fluid. Each of these seals is described in detail below.

The first class of seal, referred to herein as a contact sealing system,uses a series of seals to enable effective containment of isolatedreactions of reactors of a cell array while improving the sealingproperties at lower sealing forces. The reactors isolated according tothe sealing systems and methods described herein include single reactorsas well as one or more sets or groups of reactors used in one or more ofserial, parallel, and/or serial parallel modes. FIG. 3 shows a contactsealing system 300, under an embodiment. The contact sealing system 300is used in a multiprocessing cell array 306 in order to provide multiplesite-isolated reactors 308 for combinatorial processing of portions ofthe substrate 302 as described above. The contact sealing system 300 ofan embodiment includes a floating reactor sleeve 310 along with a seriesof seals. A compliance mechanism 300CM is configured to allow a position(e.g. height) of the floating seal 310 to “float” so that the reactor308 is dynamically configurable to contact individual portions of thesubstrate 302, as described below.

The series of seals of an embodiment comprise one or more of an inertsemi-compliant material of the floating sleeve 310 that is configured toprovide a primary seal 300PS of the reactor 308, an o-ring configured toprovide a secondary seal 300SS for secondary containment of the primaryseal 300PS, and a perimeter o-ring configured to provide a face seal300FS. The contact sealing system 300 of an embodiment also includesvacuum configured to provide a tertiary seal 300TS. The face seal 300FSis configured to contact the substrate 302 to ensure effective sealingby the tertiary seal. This perimeter seal allows for establishment of aface seal to the substrate using the vacuum or alternatively usingpneumatic force. The components of the contact sealing system 300 aredescribed in detail below.

The contact sealing system 300 thus provides site-isolated reactors withat least three levels of containment within a relatively small space.Effective seals can therefore be achieved with lower resultingcompressive force on target substrate because the multiple levels ofcontainment ensure that no mixing of reactants takes place betweenadjacent reactors.

FIG. 3A shows a contact sealing system 300 in a multiprocessing cellarray 306 mated to a stage 304 which can hold a substrate, under anembodiment. The contact sealing system 300 of an embodiment includes afloating reactor sleeve or wall 310. A floating reactor sleeve 310 isconfigured to float or be dynamically positionable in each reactor 308of the cell array reactor block 306. The combination of the reactor 308that includes the floating sleeve 310 thus forms a reactor 308 thatprovides individual compliance of each reactor edge surface 312 (formedby the floating sleeve 310) with a localized surface of a substrate.

The compliance of each reactor sleeve 310 within the reactor 308 of thereactor block 306 can be controlled or provided by an external mechanismwhich, in an embodiment, is an o-ring 314 (FIG. 3B), but is not solimited. The compliance of each reactor sleeve 310 within the reactor308 can also be provided by a flexure-type mechanism integrated directlyinto the sleeve wall. Each of the reactor sleeve compliance mechanismsare described in detail below. Use of the floating sleeves 310 in eachreactor 308 allows for replacement of individual reactor walls that maybecome contaminated or otherwise unsuitable for continued use in areactor. Further, the floating of each reactor 308 within the reactorblock 306 provided by the floating sleeves 310 allows largermanufacturing tolerances of reactor components while still providing ahigh probability that a seal is achieved for each reactor.

A first embodiment of the contact sealing system uses an externalcompliance mechanism (FIG. 3, 300CM) in an upper portion of the reactorfor controlling or providing compliance of a floating sleeve 310-B withthe wall of the reactor 308. The first embodiment also uses a series ofseals that includes the inert semi-compliant material as a primary seal,an o-ring for secondary containment of the primary seal, and a perimetero-ring face seal. The floating sleeve 310-B of an embodiment comprises avirgin resin electrical grade thermoplastic fluoropolymer likepolytetrafluoroethylene (PTFE) (Teflon®), but is not limited to thismaterial as other materials may be used as appropriate to the reactionsof particular reactors. The dimensions shown (dimensions are inches) inthe following figures are examples of the floating sleeve 310-B of anembodiment and are representative only; the dimensions are not providedto limit the embodiment.

FIG. 3B and FIG. 3C show multiple views of a floating sleeve 310-Bconfigured to interface with an external mechanism (e.g. o-ring 314) forcompliance within the reactor 308 and to include a seal system in alower region 324, under an embodiment. The floating sleeve 310-Bincludes an upper region 322 and a lower region 324 connected by a wall323. The floating sleeve 310-B and consequently the reactor 308 of thisembodiment are circular but may take on a number of different shapes indifferent embodiments as appropriate to a processing system. The upperregion 322 of the floating sleeve 310-B includes the external compliancemechanism that in an embodiment includes a protrusion 325P and a surface325S. The surface 325S is configured to interface or couple with acompliance o-ring 314. The surface of an embodiment is a smooth flatsurface but is not so limited, and alternative embodiments can includegrooves or other depressions that couple with the compliance o-ring 314.Alternatively, the compliance o-ring 314 can be permanently orremoveably connected to the surface 325S.

The protrusion 325P of the floating sleeve 310-B couples with a recess325R in the reactor block 306 and, in conjunction with the complianceo-ring 314, controls float of the sleeve 310-B in the reactor 308 over apre-specified range of motion. The range of motion of an embodiment istherefore determined by dimensions and/or properties of material of thecompliance o-ring 314 along with a dimension of the recess 325R in thereactor block 306.

The contact sealing system of an embodiment includes a primary and asecondary seal formed in the lower region 324 of the sleeve 310-B. Theprimary seal 328 of an embodiment is formed using an inertsemi-compliant region or material of the sleeve 310-B. The primary seal328 is positioned in a lower region of the floating sleeve 310 and isformed from a groove 326 in the bottom of the sleeve 310-B but is not solimited. The groove 326 of an embodiment is a dove-tail groove that isconfigured to retain a face seal but is not so limited. The lower region324 of the floating sleeve 310-B is configured to receive and containfor example an o-ring seal (FIG. 3, secondary seal 300SS) in the groove326. The o-ring seal, when positioned in the groove 326, providessecondary containment of a reaction in the reactor 308 while the primaryseal 328 (inner wall of the floating sleeve 310-B) provides primarycontainment of the reaction through approximately direct contact withthe substrate.

The compliance of each floating reactor sleeve 310 within the reactor308 of the reactor block 306 can alternatively be controlled by aflexure-type compliance mechanism 340 integrated or contained in thewall 333 of the floating sleeve 310. FIG. 3D and FIG. 3E show multipleviews of a floating sleeve 310-C configured to include a flexurecompliance mechanism 340 for compliance within the reactor 308 and aseal system in a lower region 334, under an embodiment. The floatingsleeve 310-C includes an upper region 332 and a lower region 334connected by a wall 333. The floating sleeve 310-C and consequently thereactor 308 of this embodiment are circular but may take on a number ofdifferent shapes in different embodiments as appropriate to a processingsystem. The floating sleeve 310-C of an embodiment comprises a virginresin electrical grade thermoplastic fluoropolymer likepolytetrafluoroethylene (PTFE) (Teflon®), but is not limited to thismaterial. The dimensions shown (dimensions are inches) in the followingfigures are examples of the floating sleeve 310-C and are representativeonly; the dimensions are not provided to limit the embodiment.

The upper region 332 of the floating sleeve 310-C is configured toinclude the flexure mechanism 340 that couples with an upper portion ofthe reactor block 306. The flexure mechanism includes a set of grooves340R and 340B or notches in an upper portion of the wall of the floatingsleeve 310-C. The set of grooves of an embodiment include opposinggrooves so that an aperture of a first groove 340B faces the reactorblock 306 and an aperture of a second groove 340R faces the reactor 308.The configuration of the opposing grooves 340R and 340B forms a thincompliant flange 340F between the grooves 340R and 340B that allows theupper portion of the floating sleeve 310-C to flex such that the lowersurface 312 complies with the position of the substrate 202. Therefore,the floating sleeve 310-C floats within the reactor 308 so that theprimary seal 338 “finds” or contacts a surface of the substrate. Oncethe floating sleeve 310-C is positioned relative to the substratesurface, the floating sleeve 310-C will flex so that an upper portion ofthe floating sleeve 310-C comes into firm contact with a portion of thereactor block 306 so as to maintain the position of the floating sleeve310-C in the reactor block 306 during such time as a reaction is takingplace in the reactor 308. In this manner the flexure compliancemechanism 340 controls compliance between the floating sleeve 310-C, thereactor block 306, and the substrate 202, which is clamped togethereither by vacuum or pneumatic force as described below. The thickness ofthe thin compliant flange 340F can be varied to provide a predeterminedstiffness and resulting force on the primary sealing surface 338 and/orsecondary compliant seal described below.

The upper region 332 of the floating sleeve 310-C also includes aprotrusion 335P configured to couple with a recess (not shown) in thereactor block 306 and, in conjunction with the flexure compliancemechanism 340 controls float of the sleeve 310-C in the reactor 308 overa pre-specified range of motion. The range of motion of an embodiment istherefore determined by a dimension of the recess in the reactor block306.

The contact sealing system of an embodiment includes a primary and asecondary seal formed in the lower region 334 of the sleeve 310-C. Theprimary seal 338 of an embodiment is formed using an inertsemi-compliant region or material of the sleeve 310-C. The primary seal338 is positioned in a lower region of the floating sleeve 310-C and isformed from a groove 336 in the bottom of the sleeve 310-C but is not solimited. The lower region 334 of the floating sleeve 310-C is configuredto receive and contain for example an o-ring seal (not shown) in thegroove 336. The o-ring seal, when positioned in the groove 336, providessecondary containment of a reaction in the reactor 308 while the primaryseal 338 (inner wall of the floating sleeve 310-C) provides primarycontainment of the reaction through approximately direct contact withthe substrate.

The system of an embodiment uses vacuum to provide a tertiary seal asdescribed above. The vacuum is provided via a series of vacuum channels300V (FIG. 3A) in or through the reactor block 306. The vacuum works inconjunction with the face seal 300FS, which is configured to contact theprocessed substrate to ensure effective sealing by the tertiary seal.This face seal 300FS therefore establishes a perimeter seal to thesubstrate using the vacuum or alternatively using pneumatic force.

With reference to FIG. 3A, the plenum area external to the isolatedreactor chambers 308 of an embodiment can be pressurized. Thepressurization is used, for example, to prevent leakage of materialsoutside of each isolated reactor chamber 308. Also, pressurizing theplenum and then measuring the pressure drop over time allows formonitoring of the sealing performance of the floating sleeves 310.Furthermore, pressurization of the plenum prevents or minimizes thechance of release or uncontrolled venting of potentially toxic compoundsfrom the isolated reactor chambers 308.

The contact sealing systems described above are provided as examples ofintegration into a site-isolated reactor of one or more of the floatingsleeve, compliance mechanism, inert semi-compliant material of thefloating sleeve configured to provide a primary seal of the reactor, ano-ring configured to provide a secondary seal for secondary containmentof the reactor primary seal, and/or a perimeter o-ring configured toprovide a face seal. Reactors of various alternative embodiments caninclude any of the floating sleeve, compliance mechanism, primaryreactor seal (e.g. material of the floating sleeve, etc.), secondaryreactor seal (e.g. o-ring, etc.), and/or perimeter face seal (e.g.o-ring, etc.) individually or in any combination. Thus, each of thefloating sleeve, compliance mechanism, primary reactor seal (e.g.material of the floating sleeve, etc.), secondary reactor seal (e.g.o-ring, etc.), and/or perimeter face seal (e.g. o-ring, etc.) is notlimited to use with another or any particular ones of the floatingsleeve, compliance mechanism, primary reactor seal (e.g. material of thefloating sleeve, etc.), secondary reactor seal (e.g. o-ring, etc.),and/or perimeter face seal (e.g. o-ring, etc.).

As one example of an alternative embodiment, a site-isolated reactor caninclude only the floating sleeve and the compliance mechanism describedabove. As another example of an alternative embodiment, a site-isolatedreactor can include only the floating sleeve, the compliance mechanism,and the primary reactor seal described above. In yet another alternativeembodiment, a site-isolated reactor can include only the floatingsleeve, the compliance mechanism, and the perimeter face seal describedabove. As still another alternative embodiment, a site-isolated reactorcan include only the floating sleeve and the primary reactor sealdescribed above. A further alternative embodiment of the site-isolatedreactor can include only the floating sleeve and the secondary reactorseal described above. The alternative embodiments described above areprovided as a few examples of various other combinations of the floatingsleeve, compliance mechanism, primary reactor seal (e.g. material of thefloating sleeve, etc.), secondary reactor seal (e.g. o-ring, etc.),and/or perimeter face seal (e.g. o-ring, etc.) in a reactor, and otheralternative embodiments are possible hereunder.

As an alternative to the contact sealing system described above a secondclass of seal, referred to herein as a hydrodynamic sealing system, usesa sealing fluid to contain reactor contents by forming a hydrodynamicbarrier between reactors of a multiprocessing cell array. Thehydrodynamic barrier takes the place of one or more conventional contactseals. The hydrodynamic sealing system 400 is used in a multiprocessingcell array in order to provide multiple site-isolated reactors 408 forcombinatorial processing of portions of the substrate 402 as describedabove.

FIG. 4 shows a hydrodynamic sealing system 400, under an embodiment. Thehydrodynamic sealing system 400 uses a sealing fluid 410 to form ahydrodynamic barrier configured to be the primary containment thatisolates each reactor 408 of a multiprocessing cell array from a numberof adjacent reactors 408AA and 408AB. The hydrodynamic sealing system400 of an embodiment also includes a face seal 400FS in a region of theperimeter of a substrate. The face seal 400FS encapsulates approximatelythe entire area of a substrate 402 and provides secondary containment ofthe reaction species. The sealing fluid 410 is inert to the reaction ofone or more of the reactors 408, 408AA, 408AB so that the sealing fluid410 does not introduce contamination to any reaction of any reactor 408,408AA, 408AB.

The hydrodynamic seal is provided by positioning the reactors above asurface of the substrate 402 without substrate contact. The positioningof the reactors in proximity to the substrate 402 results in formationof a controlled gap 420 between the bottom portion of the reactors andthe substrate 402. The reactors therefore do not come into physicalcontact with the substrate. The span of the controlled gap 420 can bemodulated via the characteristics (e.g., fluid constituents,hydrophobicity, hydrophilicity, reactivity, viscosity, etc.) of thesealing fluid 410 and/or the reactants of the reactors 408, 408AA,408AB.

A hydrodynamic bearing mechanism controls the float height of thereactors 408 above the substrate, and thus the controlled gap 420, bycontrolling respective pressures of the sealing fluids 410 and theeffluent channel but is not so limited. The sealing fluid 410 isintroduced into the hydrodynamic sealing system 400 through a first setof channels 412 in a perimeter space 404 or wall of the reactor 408. Thefirst set of channels 412 of an embodiment includes one channel butalternative embodiments can include any number or type of channels orpassageways. Reaction fluid 418 is also introduced into the reactor 408and contained in the reactor 408 for the duration of a static reactioninvolving the reaction fluid 418. The sealing fluid 410 serves to form ahydrodynamic barrier that contains the reaction fluid 418 in the reactor408 to which it is introduced. In one embodiment, this can be achievedby choosing an appropriate (e.g. higher) flow of the sealing fluid 410and/or (e.g. short) process duration to limit out-diffusion of thereaction fluid 418 from the reactor 408 to which it is introduced. Thehydrodynamic seal thus encapsulates a specific area or region of thesubstrate 402 within the reactor 408 by limiting the edge-to-edge flowof the reaction fluid 418 to the approximate boundaries established bythe sealing fluid 410. Upon completion of a reaction, the reaction fluid418 is removed from the reactor 408 (e.g. via suction) but is not solimited.

The sealing fluid 410 is collected along with reaction effluents 419through a second set of channels 414 in a perimeter space 404 of thereactor 408. The second set of channels 414 of the reactor perimeterspace 404 is located between the first set of channels and the reactorto which the channels 414 correspond, in an area defined as a sealingchannel. The second set of channels 414 of an embodiment includes onechannel but alternative embodiments can include any number or type ofchannels or passageways. The hydrodynamic sealing system of anembodiment includes a vacuum source for collecting the sealing fluid 410and/or reaction effluents 419 through the second set of channels 414.

The hydrodynamic sealing system described above providesreactor-to-reactor isolation without having reactor components in directphysical contact with the substrate, thereby reducing or eliminating thepossibility of reaction contamination due to physical contact with thereactor. The hydrodynamic sealing system also provides two levels ofcontainment to ensure no leakage of reactants to the atmosphere.

The sealing systems described above seal using the substrate surface asone face of the seal. Further, the sealing systems minimize or eliminatethe impact of the seal formation (e.g. abrasion, residue, etc.) on boththe substrate and the reaction occurring within the miniaturizedreactor. Additionally, the sealing systems maximize the internalreaction area compared to the area of the seal. Also, becauseembodiments may use tens to hundreds of seals per processed substrate,the sealing systems incorporate a very low probability for failure aswell at a very low fatigue rate so that the same seal can be used manytimes without replacement.

The hydrodynamic sealing system described above is provided as anexample of integration into a reactor one or more of the hydrodynamicbarrier and/or face seal. Reactors of various alternative embodimentscan include any of the hydrodynamic barrier and/or face seal alone or incombination. Furthermore, various alternative embodiments of a reactorcan include the hydrodynamic barrier along with one or more of thefloating sleeve, compliance mechanism, inert semi-compliant material ofthe floating sleeve configured to provide a primary seal of the reactor,the o-ring configured to provide a secondary seal for secondarycontainment of the reactor primary seal, and/or a perimeter o-ringconfigured to provide a face seal of the contact sealing systemdescribed above. Reactors of various alternative embodiments cantherefore include any of the hydrodynamic barrier, floating sleeve,compliance mechanism, primary reactor seal (e.g. material of thefloating sleeve, etc.), secondary reactor seal (e.g. o-ring, etc.),and/or perimeter face seal (e.g. o-ring, etc.) individually or in anycombination. Thus, each of the hydrodynamic barrier, floating sleeve,compliance mechanism, primary reactor seal (e.g. material of thefloating sleeve, etc.), secondary reactor seal (e.g. o-ring, etc.),and/or perimeter face seal (e.g. o-ring, etc.) is not limited to usewith another or any particular ones of the hydrodynamic barrier,floating sleeve, compliance mechanism, primary reactor seal (e.g.material of the floating sleeve, etc.), secondary reactor seal (e.g.o-ring, etc.), and/or perimeter face seal (e.g. o-ring, etc.).

The sealing systems of an embodiment include a processing systemcomprising a reactor block. The reactor block of an embodiment comprisesa cell array that includes a plurality of site-isolated reactors (SIRs).The sealing systems of an embodiment include a sleeve coupled to aninterior of each of the plurality of SIRs. The sleeve of an embodimentincludes a compliance device configured to dynamically control avertical position of the sleeve in the SIRs. The sealing systems of anembodiment include a sealing system configured to provide a seal betweena region of a substrate and the interior of each of the SIRs.

Each sleeve of an embodiment is configured to be dynamicallypositionable in a respective SIR. The SIR of an embodiment including thesleeve is compliant with a localized surface of the region of thesubstrate.

The compliance device of an embodiment includes a compliance seallocated external to a top portion of the sleeve. The compliance seal ofan embodiment is an o-ring positioned between a surface of the topportion of the sleeve and a surface of the reactor block.

The compliance device of an embodiment includes a flexure deviceintegrated in a top portion of the sleeve. The flexure device of anembodiment includes a plurality of grooves in one or more surfaces ofthe sleeve. The plurality of grooves of an embodiment includes twoopposing grooves. A first groove of an embodiment includes an apertureconfigured to face the reactor block. A second groove of an embodimentincludes an aperture configured to face an interior of the SIR.

The sleeve of an embodiment is configured to be replaced.

The sealing system of an embodiment includes a contact sealing system.

The contact sealing system of an embodiment includes a first sealcomprising a semi-compliant material of a lower portion of the sleeve.

The contact sealing system of an embodiment includes a second seal. Thelower portion of the sleeve of an embodiment is coupled to the secondseal. A groove in a surface of the lower portion of the sleeve of anembodiment is configured to accept the second seal. The second seal ofan embodiment is an o-ring.

The contact sealing system of an embodiment includes a third sealconfigured to seal a perimeter of the reactor block to the substrate.The third seal of an embodiment includes a face seal coupled between thereactor block and the substrate. The face seal of an embodiment is ano-ring.

The third seal of an embodiment includes a fluid. The reactor block ofan embodiment includes a duct that is configured to deliver the fluidwith a pressure. The fluid of an embodiment is air and the pressure isone of a higher pressure and a lower pressure relative to a pressure ofthe SIRs.

While the sealing system described herein may be described in terms of a“first,” “second” and/or “third” seal or, alternatively, a “primary,”“secondary” and/or tertiary” seal, the embodiments are not limited tothose having three or any other number of seals. Terms like “first,”“second,” “third,” “primary,” “secondary,” and/or tertiary” are usedherein only to differentiate between the seals and for no other purpose.

The sealing system of an embodiment includes a plurality of seals. Theplurality of seals of an embodiment include a first seal formed with asemi-compliant material of a lower portion of the sleeve and a secondseal positioned in a groove of the lower portion of the sleeve. Aportion of the groove of an embodiment comprises the semi-compliantmaterial.

The sealing system of an embodiment includes a hydrodynamic sealingsystem.

The hydrodynamic sealing system of an embodiment includes a first sealformed with a sealing fluid. The sealing fluid of an embodiment forms ahydrodynamic barrier that encapsulates the region of the substratewithin a respective SIR.

The sealing system of an embodiment includes a first set of channels inthe reactor block. The first set of channels of an embodiment isconfigured to deliver the sealing fluid to the region of the substrate.The delivered fluid of an embodiment forms the hydrodynamic barrier.

The sealing system of an embodiment includes a second set of channels inthe reactor block. The second set of channels of an embodiment isconfigured to remove the sealing fluid from an area of the hydrodynamicbarrier. The second set of channels of an embodiment is configured toremove reaction effluents from the SIR.

The sealing system of an embodiment comprises a bearing device thatcontrols at least one parameter of the sealing fluid. The bearing deviceof an embodiment controls a float height of each SIR relative to theregion. Parameters of the sealing fluid of an embodiment include one ormore of temperature, pressure, composition, viscosity, flow state, andflow rate.

The sealing fluid of an embodiment is inert relative to reactioncomponents of the respective SIR.

The hydrodynamic sealing system of an embodiment includes a face sealcoupled between the reactor block and the substrate. The face seal of anembodiment is an o-ring.

The substrate of an embodiment includes one or more of blanket wafers,patterned wafers, substrates including devices, substrates includingfunctional chips, substrates including functional devices, andsubstrates including test structures.

One or more regions of the substrate of an embodiment include one ormore of semiconductors, integrated circuits, flat panel displays,optoelectronic devices, data storage devices, magnetoelectronic devices,magnetooptic devices, molecular electronic devices, solar cells,photonic devices, and packaged devices.

The SIR and the substrate of an embodiment are configured to moverelative to each other.

The sealing systems of an embodiment include a plurality of modules. Atleast one of the plurality of modules of an embodiment includes at leastone SIR of the plurality of SIRs. The at least one SIR of an embodimentis configured for processing of the substrate that includes one or moreof molecular self-assembly and combinatorial processing. At least one ofmaterials, processes, processing conditions, material applicationsequences, and process sequences of an embodiment is different for theprocessing in at least one region of the substrate from at least oneother region of the substrate.

At least one module of the plurality of modules of an embodiment isconfigured to contain at least one of a plurality of different processesas appropriate to the processing and one or more processes contained inat least one other of the plurality of modules.

The plurality of modules of an embodiment includes at least one of a wetprocessing module, a dry processing module, and a treatment module.

The wet processing module of an embodiment includes at least one ofclean modules, rinse modules, dry modules, electroless depositionmodules, and electrochemical deposition modules, wherein the dryprocessing module includes at least one of plasma processing modules,vapor phase processing modules, ion flux processing modules, radicalflux processing modules, neutral flux processing modules, atomic fluxprocessing modules, and chemical flux processing modules, wherein thetreatment module includes at least one of annealing modules, laserprocessing modules, vaporization modules, ultraviolet (UV) treatmentmodules, and e-beam treatment modules.

The sealing system of an embodiment includes at least one controllercoupled and configured to control an environment that includes at leastone of an internal environment that is internal to at least one of theplurality of modules and an external environment that is external to atleast one of the plurality of modules. The controller of an embodimentcontrols at least one of temperature, pressure, and composition of theenvironment.

The processing of an embodiment includes modifying the substrate. Themodifying includes one or more of physical modifications, chemicalmodifications, electrical modifications, thermal modifications, magneticmodifications, photonic modifications, and photolytic modifications.

One or more of the physical modifications, chemical modifications,electrical modifications, thermal modifications, magnetic modifications,photonic modifications, and photolytic modifications of an embodimentinclude one or more of cleaning, surface modification, surfacepreparation, deposition, etching, planarization, chemical mechanicalplanarization, electrochemical mechanical planarization, lithography,patterning, implantation, irradiation, electromagnetic irradiation,microwave irradiation, radio frequency (RF) irradiation, thermaltreatment, infrared (IR) treatment, ultraviolet (UV) treatment, deepultraviolet (DUV) treatment, extreme ultraviolet (EUV) treatment,electron beam treatment, and x-ray treatment.

The deposition of an embodiment includes one or more of electrochemicaldeposition, electroless deposition, physical vapor deposition, chemicalvapor deposition, atomic layer deposition, vapor phase epitaxy, liquidphase epitaxy, chemical beam epitaxy, molecular beam epitaxy, molecularself-assembly, and evaporation, wherein surface modification includesfunctionalization.

The processing of an embodiment includes modifying at least one of thetwo or more regions of the substrate using one or more predefinedsequence of modifications.

The processing of an embodiment includes modifying at least one of thetwo or more regions using a predefined sequence of modifications andmodifying the at least one other region using a different predefinedsequence of modifications.

The processing of an embodiment includes one or more of sequentiallyprocessing regions of at least one group of regions and simultaneouslyprocessing regions of at least one other group of regions.

At least one module of the plurality of modules of an embodiment isconfigured to characterize the substrate.

The characterizing of an embodiment includes one or more of sequentiallycharacterizing regions of at least one group of regions andsimultaneously characterizing regions of at least one other group ofregions. The characterizing of an embodiment includes characterizing atleast one region of the substrate for material properties that includeone or more of optical properties, chemical composition, chemicalreactivity, electrical properties, physical properties, magneticproperties, thermal properties, mechanical properties, and porosity. Thecharacterizing of an embodiment includes characterizing at least oneregion of the substrate for structural properties that include one ormore of material location, material distribution, material thickness,material step coverage, material continuity, and mechanical properties.The characterizing of an embodiment includes parametric testing of atleast one region of the substrate that includes testing for one or moreof yield, via chain yield, line yield, via resistance, line resistance,Kelvin resistance, leakage, and capacitance. The characterizing of anembodiment includes device testing of at least one region of thesubstrate. Device testing of an embodiment is selected from one or moreof operational frequency, switching speed, power dissipation, mobility,transconductance, drive current, threshold voltage, capacitance,resistance, and charge density. The characterizing of an embodimentincludes reliability testing of at least one region of the substratethat includes testing for one or more of stress migration,electromigration, bias thermal stress, thermal stress, mechanicalstress, environmental stress of at least one environmental parameter,and time dependent dielectric breakdown.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense as opposed to anexclusive or exhaustive sense; that is to say, in a sense of “including,but not limited to.” Words using the singular or plural number alsoinclude the plural or singular number respectively. Additionally, thewords “herein,” “hereunder,” “above,” “below,” and words of similarimport refer to this application as a whole and not to any particularportions of this application. When the word “or” is used in reference toa list of two or more items, that word covers all of the followinginterpretations of the word: any of the items in the list, all of theitems in the list and any combination of the items in the list.

The above description of illustrated embodiments of the sealing systemsand methods is not intended to be exhaustive or to limit the sealingsystems and methods to the precise form disclosed. While specificembodiments of, and examples for, the sealing systems and methods aredescribed herein for illustrative purposes, various equivalentmodifications are possible within the scope of the sealing systems andmethods, as those skilled in the relevant art will recognize. Theteachings of the sealing systems and methods provided herein can beapplied to other processing systems and methods, not only for thesystems and methods described above.

The elements and acts of the various embodiments described above can becombined to provide further embodiments. These and other changes can bemade to the sealing systems and methods in light of the above detaileddescription.

In general, in the following claims, the terms used should not beconstrued to limit the sealing systems and methods to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all processing systems that operate under theclaims. Accordingly, the sealing systems and methods are not limited bythe disclosure, but instead the scope of the sealing systems and methodsis to be determined entirely by the claims.

While certain aspects of the sealing systems and methods are presentedbelow in certain claim forms, the inventors contemplate the variousaspects of the sealing systems and methods in any number of claim forms.Accordingly, the inventors reserve the right to add additional claimsafter filing the application to pursue such additional claim forms forother aspects of the sealing systems and methods.

1. A processing system comprising: a reactor block comprising a cellarray that includes a plurality of site-isolated reactors (SIRs); asleeve coupled to an interior of each of the plurality of SIRs, thesleeve including a compliance device configured to dynamically control avertical position of the sleeve in the SIRs; and a sealing systemconfigured to provide a seal between a region of a substrate and theinterior of each of the SIRs.
 2. The system of claim 1, wherein eachsleeve is configured to be dynamically positionable in a respective SIR,wherein the SIR including the sleeve is compliant with a localizedsurface of the region of the substrate.
 3. The system of claim 1,wherein the compliance device includes a compliance seal locatedexternal to a top portion of the sleeve.
 4. The system of claim 3,wherein the compliance seal is an o-ring positioned between a surface ofthe top portion of the sleeve and a surface of the reactor block.
 5. Thesystem of claim 1, wherein the compliance device includes a flexuredevice integrated in a top portion of the sleeve.
 6. The system of claim5, wherein the flexure device includes a plurality of grooves in one ormore surfaces of the sleeve.
 7. The system of claim 6, wherein theplurality of grooves include two opposing grooves, wherein a firstgroove includes an aperture configured to face the reactor block and asecond groove includes an aperture configured to face an interior of theSIR.
 8. The system of claim 1, wherein the sleeve is configured to bereplaced.
 9. The system of claim 1, wherein the sealing system includesa contact sealing system.
 10. The system of claim 9, wherein the contactsealing system includes a first seal comprising a semi-compliantmaterial of a lower portion of the sleeve.
 11. The system of claim 9,wherein the contact sealing system includes a second seal, wherein thelower portion of the sleeve is coupled to the second seal.
 12. Thesystem of claim 11, wherein a groove in a surface of the lower portionof the sleeve is configured to accept the second seal.
 13. The system ofclaim 11, wherein the second seal is an o-ring.
 14. The system of claim9, wherein the contact sealing system includes a third seal configuredto seal a perimeter of the reactor block to the substrate.
 15. Thesystem of claim 14, wherein the third seal includes a face seal coupledbetween the reactor block and the substrate.
 16. The system of claim 15,wherein the face seal is an o-ring.
 17. The system of claim 14, whereinthe third seal includes a fluid, wherein the reactor block includes aduct that is configured to deliver the fluid with a pressure.
 18. Thesystem of claim 17, wherein the fluid is air and the pressure is one ofa higher pressure and a lower pressure relative to a pressure of theSIRs.
 19. The system of claim 1, wherein the sealing system includes aplurality of seals.
 20. The system of claim 19, wherein the plurality ofseals include a first seal formed with a semi-compliant material of alower portion of the sleeve and a second seal positioned in a groove ofthe lower portion of the sleeve.
 21. The system of claim 20, wherein aportion of the groove comprises the semi-compliant material.
 22. Thesystem of claim 1, wherein the sealing system includes a hydrodynamicsealing system.
 23. The system of claim 22, wherein the hydrodynamicsealing system includes a first seal formed with a sealing fluid,wherein the sealing fluid forms a hydrodynamic barrier that encapsulatesthe region of the substrate within a respective SIR.
 24. The system ofclaim 23, comprising a first set of channels in the reactor block, thefirst set of channels configured to deliver the sealing fluid to theregion of the substrate, wherein the delivered fluid forms thehydrodynamic barrier.
 25. The system of claim 23, comprising a secondset of channels in the reactor block, the second set of channelsconfigured to remove the sealing fluid from an area of the hydrodynamicbarrier.
 26. The system of claim 25, wherein the second set of channelsis configured to remove reaction effluents from the SIR.
 27. The systemof claim 23, further comprising a bearing device that controls at leastone parameter of the sealing fluid, wherein the bearing device controlsa float height of each SIR relative to the region.
 28. The system ofclaim 27, wherein the at least one parameter includes one or more oftemperature, pressure, composition, viscosity, flow state, and flowrate.
 29. The system of claim 23, wherein the sealing fluid is inertrelative to reaction components of the respective SIR.
 30. The system ofclaim 22, wherein the hydrodynamic sealing system includes a face sealcoupled between the reactor block and the substrate.
 31. The system ofclaim 30, wherein the face seal is an o-ring.
 32. The system of claim 1,wherein the substrate is selected from a group including blanket wafers,patterned wafers, substrates including devices, substrates includingfunctional chips, substrates including functional devices, andsubstrates including test structures.
 33. The system of claim 1, whereinone or more regions of the substrate include at least one ofsemiconductors, integrated circuits, flat panel displays, optoelectronicdevices, data storage devices, magnetoelectronic devices, magnetoopticdevices, molecular electronic devices, solar cells, photonic devices,and packaged devices.
 34. The system of claim 1, wherein the SIR and thesubstrate are configured to move relative to each other.
 35. The systemof claim 1, further comprising a plurality of modules, at least one ofthe modules including at least one SIR of the plurality of SIRs, whereinthe at least one SIR is configured for processing of the substrate thatincludes one or more of molecular self-assembly and combinatorialprocessing, wherein at least one of materials, processes, processingconditions, material application sequences, and process sequences isdifferent for the processing in at least one region of the substratefrom at least one other region of the substrate.
 36. The system of claim35, wherein at least one module of the plurality of modules isconfigured to contain at least one of a plurality of different processesas appropriate to the processing and one or more processes contained inat least one other of the plurality of modules.
 37. The system of claim35, wherein the plurality of modules includes at least one of a wetprocessing module, a dry processing module, and a treatment module. 38.The system of claim 37, wherein the wet processing module includes atleast one of clean modules, rinse modules, dry modules, electrolessdeposition modules, and electrochemical deposition modules, wherein thedry processing module includes at least one of plasma processingmodules, vapor phase processing modules, ion flux processing modules,radical flux processing modules, neutral flux processing modules, atomicflux processing modules, and chemical flux processing modules, whereinthe treatment module includes at least one of annealing modules, laserprocessing modules, vaporization modules, ultraviolet (UV) treatmentmodules, and e-beam treatment modules.
 39. The system of claim 35,further comprising at least one controller coupled and configured tocontrol an environment that includes at least one of an internalenvironment that is internal to at least one of the plurality of modulesand an external environment that is external to at least one of theplurality of modules, wherein the controller controls at least one oftemperature, pressure, and composition of the environment.
 40. Thesystem of claim 35, wherein the processing includes modifying thesubstrate, wherein the modifying includes at least one of physicalmodifications, chemical modifications, electrical modifications, thermalmodifications, magnetic modifications, photonic modifications, andphotolytic modifications.
 41. The system of claim 40, wherein the atleast one of physical modifications, chemical modifications, electricalmodifications, thermal modifications, magnetic modifications, photonicmodifications, and photolytic modifications include at least one ofcleaning, surface modification, surface preparation, deposition,etching, planarization, chemical mechanical planarization,electrochemical mechanical planarization, lithography, patterning,implantation, irradiation, electromagnetic irradiation, microwaveirradiation, radio frequency (RF) irradiation, thermal treatment,infrared (IR) treatment, ultraviolet (UV) treatment, deep ultraviolet(DUV) treatment, extreme ultraviolet (EUV) treatment, electron beamtreatment, and x-ray treatment.
 42. The system of claim 41, whereindeposition includes at least one of electrochemical deposition,electroless deposition, physical vapor deposition, chemical vapordeposition, atomic layer deposition, vapor phase epitaxy, liquid phaseepitaxy, chemical beam epitaxy, molecular beam epitaxy, molecularself-assembly, and evaporation, wherein surface modification includesfunctionalization.
 43. The system of claim 35, wherein the processingincludes modifying at least one of the two or more regions of thesubstrate using at least one predefined sequence of modifications. 44.The system of claim 35, wherein the processing includes modifying atleast one of the two or more regions using a predefined sequence ofmodifications and modifying the at least one other region using adifferent predefined sequence of modifications.
 45. The system of claim35, wherein the processing includes one or more of sequentiallyprocessing regions of at least one group of regions and simultaneouslyprocessing regions of at least one other group of regions.
 46. Thesystem of claim 35, wherein at least one module of the plurality ofmodules is configured to characterize the substrate.
 47. The system ofclaim 46, wherein the characterizing includes one or more ofsequentially characterizing regions of at least one group of regions andsimultaneously characterizing regions of at least one other group ofregions, wherein the characterizing includes characterizing at least oneregion of the substrate for material properties that include at leastone of optical properties, chemical composition, chemical reactivity,electrical properties, physical properties, magnetic properties, thermalproperties, mechanical properties, and porosity, wherein thecharacterizing includes characterizing at least-one region of thesubstrate for structural properties that include at least one ofmaterial location, material distribution, material thickness, materialstep coverage, material continuity, and mechanical properties, whereinthe characterizing includes parametric testing of at least one region ofthe substrate that includes testing for at least one of yield, via chainyield, line yield, via resistance, line resistance, Kelvin resistance,leakage, and capacitance, wherein the characterizing includes devicetesting of at least one region of the substrate, wherein device testingis selected from a group consisting of operational frequency, switchingspeed, power dissipation, mobility, transconductance, drive current,threshold voltage, capacitance, resistance, and charge density, whereinthe characterizing includes reliability testing of at least one regionof the substrate that includes testing for at least one of stressmigration, electromigration, bias thermal stress, thermal stress,mechanical stress, environmental stress of at least one environmentalparameter, and time dependent dielectric breakdown.